Ultra-Fine Green Silicon Carbide Micropowder for Optical and Ceramic Processing
Product Introduction
Green silicon carbide micropowder is produced by high-temperature smelting in resistance furnace with quartz sand and petroleum coke as main raw materials, followed by crushing, precision classification and purification. It is bright green hexagonal crystal. Compared with black silicon carbide, it has higher purity, proper brittleness and outstanding self-sharpening property with sharp cutting edges. Featuring stable chemical performance, excellent acid and alkali resistance and good thermal conductivity, it is a preferred superhard abrasive for precision lapping, polishing and wire sawing of hard and brittle materials.
Key Advantages
- High purity: SiC ≥99%, low free carbon and low ferric oxide, controllable impurities to reduce workpiece scratches
- High hardness & superior self-sharpening: Mohs hardness 9.4. New cutting edges keep forming during grinding for high surface finish
- Accurate particle size: Narrow particle size distribution tested by laser particle analyzer. Compliant with FEPA, JIS and GB standards, submicron grades available upon request
- Excellent chemical stability: Resistant to acid and alkali, stable under high temperature, suitable for wet polishing, polishing slurry and ceramic sintering
- Optional surface modification: Improved dispersion performance in water-based or oil-based systems
Typical Specifications
| Item | Parameter |
|---|---|
| SiC Content | ≥99.0% |
| Free Carbon | ≤0.20% |
| Fe₂O₃ | ≤0.10% |
| Mohs Hardness | 9.4 |
| True Density | 3.20 g/cm³ |
| Bulk Density | 1.40–1.60 g/cm³ |
| Crystal Form | Hexagonal α-SiC |
| Color | Bright Green |
| Available Grades | F230 ~ F2000, JIS240# ~ JIS10000#, submicron powder |
Applications
- Photovoltaic & Semiconductor: Wire cutting, lapping and fine polishing for monocrystalline silicon, polycrystalline silicon, sapphire and SiC wafers
- Optical Industry: Precision polishing for optical glass, quartz, lenses, crystals and agate
- Hard Alloy Tools: Lapping and honing for PCD cutters, tungsten carbide and moulds
- Ceramic Industry: Raw material and sintering additive for piezoelectric ceramics, structural ceramics and refractory ceramics
- Gem & Stone: Polishing for jade, marble and granite
- Abrasive Products: Raw material for resin grinding discs, polishing pads, lapping compounds and polishing slurries
- Micro Blasting: Surface micro-blasting treatment for titanium alloy and hard alloy
Packaging & Delivery
- Packing: 25kg per bag (PE inner liner + woven bag). Jumbo bag, neutral packing and OEM packing are available
- Quality Control: COA and particle size report are provided with shipment. TDS can be supplied on request
- MOQ: Sample orders and full container orders are both acceptable. FOB and CIF quotations are supported
Storage Instruction
Store in dry and ventilated warehouse, keep away from moisture and strong oxidants. Use as soon as possible after opening to prevent caking.
