Green silicon carbide f600 Green SiC 10micron 11micron

Green silicon carbide f600 Green SiC 10micron 11micron

/MT

Green silicon carbide f600 Green SiC 10micron 11micron 

Green Silicon Carbide is produced at high temperature in an electric resistance type furnace with quarts sand and petroleum coke. It is a synthetic brittle carborundum with high thermal conductivity and high strength which get no decrease in 1000℃( 7.5 times stronger than Alumina)

Green silicon carbide is characterized with extreme hardness (Mohs 9.4/2600 Knoop) which only rank after CBN and B4C.

Mohs Hardness:9.5
Vickers Hardness:3100-3400kg/mm2
Specific Gravity:3.2g/cm3
Bulk density(LPD):1.2-1.6 g/cm3
Color:Green
Particle shape:Hexagonal
Melting Point:Dissociated at about 2600 centigrade
Maximum service temperature:1900 centigrade
FriabilityFriable
Thermal conductivity0.013 cal/cm2.sec (900°C)
Thermal expansion coefficient

7-9 x10-6 /℃(0-1600°C)

TYPICAL CHEMICAL ANALYSIS(Green silicon carbide f600 Green SiC 10micron 11micron )
Chemical ContentF20-F220F230-F2000
SiCMin 99%Min 98.5%
SiO2Max 0.50%Max 0.70%
F,SiMax 0.20%Max 0.40%
Fe2O3Max 0.10%Max 0.15%
F.CMax 0.20%Max 0.30%
L.O.IMax 0.05%

Max 0.09%

Green silicon carbide application:(Green silicon carbide f600 Green SiC 10micron 11micron )

1. Precision polishing for hard optical glass such as camera lens.

2. Abrasive blasting on hard metal CNB knife such as titanium alloy, carbide alloy, etc.

3. Polishing and grinding quartz glass.

4. Grinding hard stone, marbles, granite, etc.

5. Polishing PZT/ Piezoelectric ceramic.

6. Blasting copper and copper alloy.

7. Surface treatment on diamond tools.

8. Wire sawing.

9. Polishing jewelry such as diamond and cinnabar.

10. Grinding other thin brittle material precise component.

11. Anti-fire novel Nano Aerogel.

12. Fire insulation material such as sintered ceramics.

13. Teflon coating.

14. Fluorocarbon coating and paint.

15. High quality brake additives such as aero plane brakes.

16. Silicon carbide ceramic filler.

17. Polishing tools such as wet diamond polishing pad, PVC grinding disc, etc.

Particle SizeParticle Distribution (µm)
Maximum Particle SizeParticle Size at d03Particle Size at d50Particle Size at d94
# 240≤ 127≤ 10358.6 ± 3.0≥ 40.0
# 280≤ 112≤ 87.049.4 ± 3.0≥ 33.0
# 320≤ 98.0≤ 74.041.1 ± 2.5≥ 27.0
# 360≤ 86.0≤ 66.036.1 ± 2.0≥ 23.0
# 400≤ 75.0≤ 58.030.9 ± 2.0≥ 20.0
# 500≤ 63.0≤ 50.026.4 ± 2.0≥ 16.0
# 600≤ 53.0≤ 43.021.1 ± 1.5≥ 13.0
# 700≤ 45.0≤ 37.017.9 ± 1.3≥ 11.0
# 800≤ 38.0≤ 31.014.7 ± 1.0≥ 9.00
# 1000≤ 32.0≤ 27.011.9 ± 1.0≥ 7.00
# 1200≤ 27.0≤ 23.09.90 ± 0.80≥ 5.50
# 1500≤ 23.0≤ 20.08.40 ± 0.60≥ 4.50
# 2000≤ 19.0≤ 17.06.90 ± 0.60≥ 4.00
# 2500≤ 16.0≤ 14.05.60 ± 0.50≥ 3.00
# 3000≤ 13.0≤ 11.04.00 ± 0.50≥ 2.00
# 4000≤ 11.0≤ 8.003.00 ± 0.40≥ 1.30
# 6000≤ 8.00≤ 5.002.00 ± 0.40≥ 0.80
# 8000≤ 6.00≤ 3.51.20 ± 0.30≥ 0.60(1)
# 100000.51~0.70

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