Semiconductor silicon wafer uses black sic powder

Semiconductor silicon wafer uses black sic powder

Black silicon carbide is produced at high temperature in an electric resistance type furnace with quartz sand, petroleum coke and bits of wood as its main raw materials. Its hardness is between fused alumina and diamond. Mechanical intensity of it is higher than fused alumina. It is crisp,sharp and have certain degree of conductive heat.Black silicon carbide is higher toughness than green silicon carbide with sic purity 98%,it has been used for processing low tensile strength of material, such as glass, ceramics, stone, refractory materials, cast iron and nonferrous metal, etc.Green silicon carbide can also be used in refractories and electronic semiconductor industry.

Physical Properties

Chemical Composition

Black silicon carbide application：

It is used for the bicycle, motorcycle, sewing machine, and clock parts.

Light ornament, plastic and hardware polishing, and also applicable to the sand blasting.

It is the production materials: manufacturing resin-cutting slice, edges and corners grinding and coated abrasives.

The black corundum particle and micro powder are suitable for stainless steel work piece polishing and abrading and making the whetstone and polishing paste.

Black corundum sand is the preferred material of the slip-prevented road and coal pits warehousing.