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Why Silicon Carbide substrate uses Silicon carbide as raw materials

Silicon carbide (SiC) substrates use silicon carbide as raw material primarily due to its exceptional physical, chemical, and electrical properties, which make it uniquely suitable for high-performance electronic and power device applications. Here is a detailed explanation of the key reasons:

1. Superior Physical and Chemical Stability

  • High Thermal Conductivity: SiC has a thermal conductivity of up to ~490 W/m·K (much higher than silicon’s ~150 W/m·K), allowing efficient heat dissipation. This is critical for high-power devices (e.g., power modules, automotive electronics) to prevent overheating and maintain reliability.
  • High Melting Point: With a melting point of ~2,700°C, SiC can withstand high temperatures without degrading, enabling operation in harsh environments (e.g., aerospace, industrial motors).
  • Chemical Inertness: Resistant to corrosion, oxidation, and harsh chemicals, SiC substrates are ideal for applications exposed to aggressive conditions (e.g., oil and gas exploration, high-temperature sensors).

2. Excellent Electrical Properties for Semiconductor Devices

  • Wide Bandgap: SiC has a bandgap of ~3.2 eV (vs. ~1.1 eV for silicon), meaning it can withstand higher voltages and operate at higher temperatures with lower energy loss. This makes it suitable for high-voltage power devices (e.g., inverters for electric vehicles, renewable energy grids) that require low power dissipation and high efficiency.
  • High Breakdown Field Strength: SiC’s breakdown field (~2.5 × 10^6 V/cm) is ~10 times higher than silicon, allowing the design of thinner, more compact devices with reduced switching losses. For example, SiC-based power MOSFETs and diodes can handle voltages up to 10 kV, making them essential for next-generation power electronics.
  • High Electron Mobility: At high electric fields, electrons in SiC move faster than in silicon, enabling faster switching speeds in transistors. This is critical for high-frequency applications like 5G base stations and radar systems.

3. Compatibility with Advanced Semiconductor Manufacturing

  • Crystal Structure and Purity: SiC can be grown in a single-crystal form with high purity and minimal defects, ensuring consistent electrical performance. Modern epitaxy techniques (e.g., chemical vapor deposition, CVD) allow the creation of high-quality thin films on SiC substrates for device fabrication.
  • Integration with Wide-Bandgap Materials: SiC serves as a substrate for other wide-bandgap semiconductors like gallium nitride (GaN), enabling hybrid device structures that combine the best of both materials (e.g., GaN-on-SiC heterostructures for high-power, high-frequency applications).

4. Environmental and Performance Advantages

  • Energy Efficiency: Devices on SiC substrates consume less energy and generate less heat, contributing to lower carbon footprints. For example, SiC-based inverters in electric vehicles can improve battery range by 5–10% compared to silicon-based alternatives.
  • Miniaturization: The high breakdown field allows thinner device layers, enabling smaller, lighter components. This is crucial for portable electronics, aerospace, and automotive applications where space and weight are critical.

5. Market Demand and Technological Trends

  • Growth in High-Power Applications: As industries shift toward electrification (e.g., electric vehicles, renewable energy storage), demand for high-voltage, high-efficiency power devices has surged. SiC substrates are central to meeting this demand.
  • 5G and Next-Generation Communications: The high-frequency capabilities of SiC make it essential for 5G infrastructure, where devices must handle high power and data rates simultaneously.

Summary: Why SiC as the Raw Material?

PropertySiC AdvantageImpact on Substrate Use
Wide bandgapHigh voltage and temperature toleranceEnables low-loss, high-power devices
High thermal conductivityEfficient heat dissipationPrevents overheating in compact designs
High breakdown fieldThin, high-voltage device layersEnables smaller, more powerful components
Chemical stabilityResistance to harsh environmentsSuitable for industrial, aerospace, and automotive use
High electron mobilityFast switching speedsCritical for high-frequency communications

 

In summary, silicon carbide’s unique combination of physical, chemical, and electrical properties makes it the material of choice for substrates in advanced electronic devices that require high performance, reliability, and efficiency in challenging environments.

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